Glossary/Thermal/Thermal headroom
Thermal headroom
Thermal headroom is the gap between a component's current temperature and its throttle point, which determines how long it can sustain boost clocks.
Also known as temperature headroom, thermal margin
Measured by SystemCheck
Part of the four-stage run: a 60-second sustained CPU load reporting throughput, decay and consistency; a memory stage reporting bandwidth and latency; a calibrated GPU raster load reporting frame time, pacing and decay; and a path tracer reporting samples per second. The paragraphs below say which metric carries this term.
Headroom is what boost algorithms spend. A chip 30 °C below its limit will boost aggressively; one 3 °C below it will not. This makes headroom, not absolute temperature, the quantity that governs how a machine behaves at any moment.
Headroom shrinks over the course of a session as the case, cooler, and ambient air all warm. It is why the same machine performs differently at the start of a work session and three hours in, and why a benchmark result depends on whether you ran it cold.
SystemCheck cannot report headroom in degrees. It measures the behavioural consequence: how much throughput falls across a sustained run. A shallow decay means you had headroom to spare through the run; a steep one means you exhausted it. For a degrees-based reading, use a hardware monitor alongside.
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